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Engineering Technology

Course Descriptions

ETEC 110: Manufacturing Basics

Credits: 5.0

Introduction to basics of manufacturing, including personal protective equipment (PPE), safety practices, and the proper use of equipment to perform basic manufacturing processes such as drilling and cutting on commonly used materials, including metals and composites. Prerequisite(s): ENGLP 090 or AENGL 090 and placement in MATH 077.

Course Level Objectives

  1. Understand the usage, operation, and benefits of basic PPE equipment.
  2. Describe standard safety practices for chemicals (MSDS), falls, power tools, electrical, etc. in a manufacturing environment.
  3. List the basic advantages/disadvantages of composites and metals and their proper handling techniques.
  4. Operate drilling and cutting equipment properly.
  5. Measure process results, such as hole dimensions and fastener torque.
  6. Develop listening comprehension especially as it relates to lectures and note taking.
  7. Develop oral questioning and listening abilities critical to academic and career success.
  8. Develop writing skills including basic grammar, summarizing, clarity, and accuracy.
  9. Increase vocabulary and vocabulary building skills especially as applied to course work and the manufacturing environment.
  10. Develop and apply study and test taking skills.

ETEC 115: Introduction to Additive Manufacturing and Rapid Prototyping

Credits: 3.0

Topics include additive manufacturing fundamentals, terminology, main categories and Rapid Prototyping machine technology types, advantages vs. disadvantages of varied additive manufacturing technologies, basic skills in 3-D software, practical application of 3-D printing. S/U grade option. Prerequisite(s): ENGR& 114 or instructor permission.

Course Level Objectives

  1. Compare the differing properties and characteristics of common materials used for additive manufacturing models.
  2. Develop a part using 3D-CAD software.
  3. Perform initial part-build setup on a 3D printer.
  4. Describe the various additive manufacturing processes.
  5. Define the terminology used in additive manufacturing today.
  6. Describe the different hardware systems used in the production of prototypes, with emphasis on the specific additive manufacturing machines used in lab activities for this course.
  7. Identify and discuss three main categories of additive manufacturing processes, including specific additive manufacturing machine types used in each of the three categories.
  8. Describe the procedures for setting up a additive manufacturing process for a part run.
  9. Demonstrate skill in the use of measurement tools, and dimensional analysis of additive manufacturing models.
  10. Apply learned skills to finish additive manufacturing model projects.

ETEC 116: Additive Manufacturing, Molding, and Casting

Credits: 3.0

Provides the student with knowledge and skills in additive manufacturing technology. Primary topics will include vacuum forming fundamentals, silicon molding, urethane, investment casting, Computer Numerical Control (CNC) operations and post processing of lab created projects. S/U grade option. Prerequisite(s): ETEC 115 or instructor permission.

Course Level Objectives

  1. Develop, create and post process parts using all processes taught in this class.
  2. Describe the various additive manufacturing processes.
  3. Describe the principles of vacuum forming and material requirements.
  4. Describe the principles of silicon molding, urethane molding, investment casting and material requirements.
  5. Perform the process of vacuum forming and material requirements.
  6. Perform the process of silicon molding, urethane molding, investment casting and material requirements.
  7. Apply learned skills to create a student/team designed functional part from the design phase to post processing.

ETEC 117: Additive Manufacturing and Metal Printing

Credits: 3.0

Obtain knowledge and skills in additive manufacturing technology. The focus will be on using the advanced capabilities of 3D modeling software, the operation and theory of metal printing equipment, and the use of scanning equipment in the additive manufacturing industry. S/U grade option. Prerequisite(s): ETEC 116 or instructor permission.

Course Level Objectives

  1. Infiltrate a metal printed part using the correct process.
  2. Demonstrate product testing procedures using created parts.
  3. Describe the principles, process, and operation of 3D metal printing equipment.
  4. Create new part files using scanning equipment.
  5. Apply learned skills to create a student/team designed functional part from the design phase to post processing.

ETEC 120: Introduction to Metrology

Credits: 5.0

Introduction to basic measurement techniques used in manufacturing and QA environments and the equipment used to perform measurements. Prerequisite(s): AENGL 090 or ENGLP 090and placement into MATH 077.?

Course Level Objectives

  1. Describe, select, and use a variety of measurement tools, such as calipers and microscopes.
  2. Establish calibration intervals using usage history and gage studies.
  3. Explain various inspection and testing concepts and processes, including Non-Destructive Testing (NDT).
  4. Explain and apply sampling systems.

ETEC 125: Aviation Fundamentals

Credits: 2.0

An exploration of the fundamentals of aviation. Principles of flight, aircraft systems, aircraft structures, control surfaces and potential aerospace careers will be covered. Requires the ability to read and communicate in English and the ability to use a computer and the Internet. Prerequisite(s): Requires the ability to read and communicate in English and the ability to use a computer and the Internet.

Course Level Objectives

  1. State the basic principles of powered flight.
  2. Identify the major components inside and outside of an aircraft.
  3. Identify and explain the resulting motion for each of the aircraft's control surfaces.
  4. List various aerospace careers.

ETEC 130: Quality Assurance Tools

Credits: 5.0

Introduction to quality assurance tools and concepts used in manufacturing and how to effectively apply and use them. Prerequisite(s): AENGL 090 or ENGLP 090and placement into MATH 087.

Course Level Objectives

  1. Calculate and apply simple control charts and describe their meaning.
  2. Select, construct, and apply the seven quality tools: cause and effect diagrams, flowcharts, check sheets, Parato diagrams, scatter diagrams, control charts, and histograms.
  3. Explain quality concepts, such as Six Sigma, cost of quality, ISO certification, and continuous improvement techniques.
  4. Describe the basic principles of audits and CAPA systems.
  5. Explain and apply basic statistical techniques such as mean and standard deviation.

ETEC 140: Basic Electricity and Electronics

Credits: 5.0

Basics of AC and DC circuits. Includes resistors, capacitors, RC circuits, inductors, filters, diodes,transistors, and operational amplifiers. Testing and troubleshooting circuits where voltage changes over time. Practice using DMM and oscilloscope. Prerequisite(s): ETEC 150 or concurrent enrollment or instructor permission.

Course Level Objectives

  1. Describe AC and DC current in electrical safety, electrical potential and current, effect of current on the body, emergency procedures in case of electrical shock, and prevention of equipment damage from electrostatic discharge.
  2. Describe the characteristicsof insulators, conductors, semiconductors, and the primary sources of voltage/current.
  3. Explain the fundamental requirements of an electrical circuit, including the impact of ground lines and the fundamental electrical properties of voltage, current, resistance, power, and their units.
  4. Demonstrate analysis of circuits by applying Ohm's Law, Kirchhoff's circuit laws, Watt's Law, the relationship among voltage, current, power,and work to troubleshoot series and parallel circuits.

ETEC 141: Digital and Microprocessor Electronics

Credits: 5.0

Introduction to digital and microprocessor circuits. Covers operation of basic logic gates, flip-flops, decoders, displays, counters, and microprocessor circuits. Lectures and hands-on exercises to learn how to analyze, test, and troubleshoot digital and microprocessor circuits. Prerequisite(s): ETEC 140 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Analyze and predict the operation of discrete logic gates and their truth tables and complex digitalschematics.
  2. Describe the common components and principle differences betweenCPUand MCU systems and how they are used in industry. Analyze a simple microprocessor program in terms of the control, addresses and data busses.
  3. Demonstrate troubleshooting techniques for discrete logic, CPU, and MCU based systems andtheir peripheral devices using a logic analyzer, oscilloscope, and multimeter.

ETEC 142: Automation Programming

Credits: 5.0

Through the use of functional testing with an oscilloscope, students will learn to troubleshoot a robotic system.Students will also program and build a robot system using the Arduino prototyping platform. Prerequisite(s): ETEC 140.

Course Level Objectives

  1. Create programs that demonstrate proficiency in programming using Arduino and ATMEL Studio.
  2. Demonstrate good coding practices, documentation, and archive maintenance using Doxygen and Git.
  3. Deploy and debug programs to multiple targets, using various techniques, including external debuggers.
  4. Work as a team to deploy a secure, functional Internet of Things project.

ETEC 143: Automation Programming and PLCs

Credits: 5.0

Students will learn the basics of Programmable Logic Controllers (PLCs) used to operate automated systems and how to program and communicate with the systems. Prerequisite(s): ETEC 141 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Describe typical applications for PLCs, their modes of operation, addressing schemes, and terminology.
  2. Describe basic PLC functions, program structures, I/O symbols, supported languages, and their use in industry.
  3. Create a basic ladder logic program utilizing inputs, outputs, timers, and counters to sequence the execution of a holding circuit.
  4. Use lab test equipment and instructional trainers and program PLCs to actuate small-scale models of industrial equipment.
  5. Demonstrate a working knowledge of different types of sensors used in automated industrial processesand how they can be integrated with PLCs.

ETEC 150: Applied Technical Math

Credits: 5.0

Using algebra and trigonometry to solve problems in electronics and manufacturing. Also covers use of scientific calculator, binary, and hexadecimal. Prerequisite(s): Placement into MATH 087 or instructor permission

Course Level Objectives

  1. Convert numbers to and from decimal, scientific, engineering, and metric notation.
  2. Use simple algebraic formulas to solve for an unknown quantity.
  3. Calculate for various electrical quantities in a circuit.
  4. Solve simple equations involving right angle trigonometry.

ETEC 155: Special Topics: Engineering Technology

Credits: Maximum of 5.0 possible

Topics of current interest in Engineering Technology.

Course Level Objectives

  1. Demonstrate knowledge of a particular area of engineering technology.

ETEC 175: Introduction to Materials Science

Credits: 5.0

Mechanical, chemical, and thermal properties of engineering materials including metals, alloys, ceramics, polymers, and composites. Includes materials microstructure, atomic bonding, atomic arrangement, crystal structure, coexisting phases, interfaces, defects, and impurities. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Explain the differences in properties of different materials, including metals, alloys, ceramics, polymers, and composites.
  2. Relate the properties of materials to microstructure.
  3. Describe the basics of processing techniques for altering the microstructure and properties of different materials.
  4. Apply the basic principles of material selection to specific applications.

ETEC 180: Polymer Technology

Credits: 5.0

Course provides an overview of thermoset and thermoplastic polymers. Topics include chemical composition, physical properties, deformation, mechanical behavior, fabrication, and processing and manufacturing of polymers. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Describe the basic properties and characteristics of polymers.
  2. Explain and apply the basics of deformation, elasticity, and mechanical behavior in polymeric materials.
  3. Explain the relationship between polymer structure and properties.
  4. Identify the different types of polymers, including elastomers and fibers.
  5. Explain the various fabrication techniques of polymeric materials, and explain the advantages and disadvantages.
  6. Apply and explain the application of polymers to engineering and composite manufacturing.
  7. Perform basic qualification and selection of polymer materials.

ETEC 199: Special Projects in Engineering Technology

Credits: 1.0 to 5.0

For projects in Engineering Technology. Credit available with approval. For information contact the Department Head.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic.
  2. Research the topic on the Internet.
  3. Track their use of time in creating this project.

ETEC 200: Introduction to Composites

Credits: 5.0

General overview of composite materials and fabrication procedures. Covers composite constituents, material forms, mold design and development, ASTM standards, fabrication processes, composite applications, bonding, fastening, laminating, and finishing techniques. Prerequisite(s): Placement in MATH 087 or ETEC 150 or concurrent enrollment.

Course Level Objectives

  1. Explain the basic properties, characteristics, and constituents of composite materials.
  2. Explain the functions and elements of ASTM standards.
  3. Explain and apply the different fabrication processes for composite materials, including bonding, fastening, laminating, and finishing techniques.
  4. Describe the primary usage of composite materials in today's industry and potential for future applications.
  5. Perform basic fabrication processes in making composite structures.
  6. Follow procedures when using lab equipment, and apply safety procedures when working in the lab.

ETEC 230: Intermediate CAD and 3D Printing

Credits: 5.0

A continuation of SOLIDWORKS with an introduction to 3D printing that will be used in conjunction with CAD modeling. Prerequisite(s): ENGR& 114 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Create advanced drawing configurations.
  2. Create assemblies that are ready for 3D printing.
  3. Print simple 3D parts.

ETEC 231: Advanced CAD and 3D Printing

Credits: 4.0

An advanced continuation of CAD using SOLIDWORKS with additional 3D printing applications and an introduction to CAM (Computer Aided Manufacturing). Prerequisite(s): ENGR& 114.

Course Level Objectives

  1. Create advanced assembly drawing configurations.
  2. Convert CAD drawings to CAM for CNC fabrication.
  3. Create and print advanced, moving 3D parts.

ETEC 242: Advanced Analog and Digital Electronics

Credits: 5.0

Advanced training in analog and digital electronics. Covers analysis, functional testing, and systematic troubleshooting of analog circuits and digital circuits designed with op-amp amplifiers and comparators, mux, demux chips, shift registers, memory circuits, latches, and buffers.Includes basic soldering techniques. Prerequisite(s): ETEC 141 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Analyze and test circuitsto integrate analog and digital sensors, actuators, and controls.
  2. Analyze common circuits used for digital and analog conversion, amplification, and detection as well as how to isolate and identify problems in mixed mode systems.
  3. Describe, build, and analyze a small robotic system with a rudimentaryvision systemfor measurement and object recognition.
  4. Document testing and troubleshooting process by recording information on both a form and a schematic.

ETEC 243: Controls and Instrumentation

Credits: 5.0

An introduction to Computer Aided Design, controls, and instrumentation used for industrial pneumatic, hydraulic, mechanical, and electrical automation systems. Prerequisite(s): ETEC 150.

Course Level Objectives

  1. Describe electronic system troubleshooting techniques, methodologies, and terminology as well as demonstrate their use in locating faults with common electrical test equipment.
  2. List the factors that affect the ability of sensors to detect a target or cause an actuator to miss its target.
  3. Describe and apply the Laws of Thermodynamics, types of heat transfer, humidity, and dew point.
  4. Describe volumetric flow rate, flow velocity, mass flow rate, and flow measurement technologies.
  5. Describe the modes of control (on-off, proportional, integral, and derivative), the affect each mode has on maintaining the process quality, and how loop tuning will assure that the process will meet and maintain quality standards.

ETEC 244: Fluid Systems

Credits: 5.0

Covers the basics of Hydraulics and Pneumatics and their use in industry. Prerequisite(s): ETEC 150.

Course Level Objectives

  1. Demonstrate knowledge of fluid power safety practices and general shop safety.
  2. Demonstrate knowledge of fluid power systems and fluid types, properties, units of measure, and energy conversion.
  3. Utilize physical laws to calculate force, pressure, flow, and energy conversions for system components.
  4. Describe pneumatic terminology, thermodynamics, topology rules, pump configurations, types, system components, schematics, and schematic symbols.

ETEC 245: Robotics in Automation

Credits: 5.0

Through the use of projects and hands-on exercises, students will learn to program a small scale robot to perform basic navigation under program control, with various sensor inputs, using feedback, and control techniques. Prerequisite(s): ETEC 140.

Course Level Objectives

  1. Describe the major components of robotic systems and the coordinate systems they operate within, degrees of freedom, and how robot axis and motion are expressed in those coordinate systems.
  2. Explain the various methods of programming and training a robot with PLCs.
  3. Describe the various sensors, actuators, tools, and image detectors used in robotic systems.
  4. Explain the use of robotic error codes and other troubleshooting techniques and demonstrate their use in troubleshooting and repair.
  5. Perform robot startup and demonstrate programming for basic motion control in the different coordinate systems available.

ETEC 246: Advanced PLCs and Communications

Credits: 5.0

Students will learn advanced applications of Programmable Logic Controllers (PLCs) used to operate automated systems. Students will learn to program and communicate with the systems. Prerequisite(s): ETEC 143.

Course Level Objectives

  1. Use Ethernet TCP/IP protocol to identify and set addresses, subnet masks, and gateways.
  2. Evaluateand install drivers for network cards and troubleshoot communications in a PLC as well as set parameters, baud rates, and dip switches.
  3. Apply troubleshooting procedures and common failure modes of PLCs and associated input, output, and control modules.
  4. Configure,connect, troubleshoot, and commission a PLC system with HMI, communications buses, and network.

ETEC 247: Machine Tools and CNC

Credits: 3.0

Students will learn the basic use of machine tools and CNC (Computer Numeric Control) systems. Prerequisite(s): ETEC 150.

Course Level Objectives

  1. Demonstrate the safe use of various hand-held and shop floor mounted machine tools and their maintenance.
  2. Demonstrate ability to program, operate, and troubleshoot CNC equipment.
  3. Demonstrate proficiency at the use and calibration of machine, hand, and measurement tools and equipment.
  4. Describe and practice electrostatic discharge prevention and other best practices for maintenance and repair of sensitive equipment.

ETEC 248: Mechanical Components and Power Transmission

Credits: 5.0

An introduction to the design, functionality, and physical properties of mechanical power transmission components, and electrical drives (AC and DC).Emphasis is on systems used in robotics, advanced manufacturing, and applied automation technology. Topics also covered are energy flow, troubleshooting, failure analysis, and predictive maintenance. Prerequisite(s): ETEC 143 with a minimum grade of 2.0 or instructor permission.

Course Level Objectives

  1. Demonstrate understanding design, functions, and physical properties of mechanical power transmission components and electrical drives (both AC and DC).
  2. Explain systems used in robotics, advanced manufacturing, and applied automation technology.
  3. Demonstrate knowledge of energy flow, troubleshooting, failure analysis, and predictive maintenance pertinent to common industrial mechanical systems.
  4. Use lab test equipment and trainers to model the setup and operation of mechanical power transmission components like those used in industry.

ETEC 250: Composites Engineering Design

Credits: 5.0

Overview of structural design utilizing composite materials including material and process selection, structural design, aesthetic qualities, assembly and practical design information. This is a lab based course focusing on product design. Prerequisite(s): ETEC 200 or concurrent enrollment.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite material.
  2. Explain the advantages of planning a design to meet the manufacturing requirements.
  3. Apply the basic principles of material and process selection, structural design, aesthetic design, and assembly.
  4. Perform design, construction, and fabrication of laminated parts.
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.
  6. Perform simple repairs of composite structures.
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, and surface preparation.

ETEC 255: Special Topics: Engineering Technology

Credits: Maximum of 5.0 possible

Topics of current interest in Engineering Technology.

Course Level Objectives

  1. Demonstrate knowledge of a special topic in engineering technology.

ETEC 260: Composites Manufacturing

Credits: 5.0

Overview of processes involved in development and production of composite products. Includes tooling, fabrication, machining, assembly, quality assurance, repair, lay-up, vacuum bagging, and cureprocessing of wet laminating techniques and pre-impregnated materials. Prerequisite(s): ETEC 200 with a minimum grade of 2.0 or concurrent enrollment.

Course Level Objectives

  1. Apply the basic principles of structural design utilizing composite materials.
  2. Explain the advantages of planning a design to meet the manufacturing requirements.
  3. Apply the basic principles of materials and process selection, structural design, aesthetic design, and assembly.
  4. Perform design, construction, and fabrication of laminated parts.
  5. Use appropriate terminology as it relates to composite structure design and manufacturing.
  6. Perform simple repairs of composite structures.
  7. Follow appropriate processes for structural and nonstructural evaluation, material handling, and surface preparation.

ETEC 290: Engineering Technology Capstone Project

Credits: 5.0

Students use the skills developed during their prior courses to work as a team to design and build a project. Prerequisite(s): ETEC 200 (or concurrent enrollment) or ETEC 243, eitherwith a minimum grade of 2.0.

Course Level Objectives

  1. Collaborate with other students and/or industry partners to define project parameters and project objectives.
  2. Prepare a written and oral presentation that describes the project.
  3. Demonstrate mastery of selected skills by completed project objectives.

ETEC 291: Engineering Technology Internship

Credits: 1.0 to 10.0

Students working toward the ETEC degree, who are in the second year of their coursework, and receive on-the-job training in materials science. One credit for each 30 hours worked. Registration permitted first seven weeks (six in summer) as space is available. Prerequisite(s): Instructor permission.

Course Level Objectives

  1. Document their work hours at the internship site and produce a supervisor's evaluation of their work.
  2. Demonstrate skills necessary for the workplace at which the internship takes place.

ETEC 292: Career Planning and Workplace Relations

Credits: 2.0

Designed to give students an overview of engineering technology careers. Includes field trips, resume building, interviewing skills, job search skills, and developing skills to work in groups. Prerequisite(s): Placement in ENGL& 101.

Course Level Objectives

  1. Search for information on specific careers.
  2. Obtain company information and assess best fit with personal professional interests and goals.
  3. Write and format an effective resume.
  4. Access local and regional resources to support job search.
  5. Apply interpersonal skills for effective teamwork, conflict resolution, motivation, leadership, and communication.

ETEC 299: Special Projects in Engineering Technology

Credits: 1.0 to 5.0

For individual projects in Engineering Technology. Note: Credit available with approval. For information, contact the department head.

Course Level Objectives

  1. Produce a circuit, project, paper or presentation on a department approved topic of the student's choice.
  2. Research the topic on the Internet.
  3. Track their use of time in creating the project.